Energies, Vol. 18, Pages 4419: Research on Thermal Performance of the Microchannel with Internal Cavities Under Al2O3-Water Nanofluid

Energies, Vol. 18, Pages 4419: Research on Thermal Performance of the Microchannel with Internal Cavities Under Al2O3-Water Nanofluid

Energies doi: 10.3390/en18164419

Authors:
Fang Li
Zewen Tan
Hu He
Youhang Zhou
Xuan Tang
Wenhui Zhu

As the demand for efficient heat dissipation in information devices continues to escalate, the heat flux of integrated packaging devices is poised to reach 100 W/cm2 universally, rendering microchannel liquid cooling technology a pivotal solution in thermal management. In this work, the microchannel heat sink with spoiler cavities, optimized via field synergy principle, was integrated into the high-power electronics, and its flow and heat transfer performance were experimentally investigated using Al2O3-water nanofluid. The results show that the experimental and simulation results of the optimized microchannel heat sink integrated with IGBT devices are in good agreement. With structural optimization combined with an appropriate volume fraction of nanofluid, the microchannel heat sink exhibited significantly better heat dissipation performance than that of rectangular heat sinks under a heat flux of 100 W/cm2. Furthermore, when the volumetric flow rate exceeded 0.6 mL/s, the heat transfer performance was improved by 38% compared to the rectangular microchannel heat sink with 1% volume fraction of Al2O3-water nanofluid.